Using liquid to air membrane energy exchanger for liquid cooling

ABSTRACT

Systems and methods for controlling conditions in an enclosed space, such as a data center, or for providing cooling to a device, can include using a Liquid-to-Air Membrane Energy Exchanger (LAMEE) as an evaporative cooler. The LAMEE or exchanger can cool water to the outdoor air wet bulb temperature in a cooling system disposed outside of the enclosed space or device. The reduced-temperature water can be delivered to the enclosed space or device or can cool a coolant that is delivered to the enclosed space or device. The air in the enclosed space, or one or more components in the enclosed space, can be cooled by delivering the reduced-temperature water or coolant to the enclosed space, rather than moving the supply air from the enclosed space to the cooling system. In an example, the cooling system can include one or more cooling coils, upstream or downstream of the LAMEE.

CLAIM OF PRIORITY

This application is a continuation of U.S. Non-Provisional applicationSer. No. 17/466,603, filed on Sep. 3, 2021 which is a continuation ofU.S. Non-Provisional application Ser. No. 15/574,201, filed on Nov. 15,2017 which is a U.S. National Stage Filing Under 35 U.S.C. § 371 ofInternational Patent Application Serial No. PCT/CA2016/050252, filed onMar. 8, 2016, and published on Nov. 24, 2016, as WO 2016/183667 A1,which claims the benefit of U.S. Provisional Patent Application Ser. No.62/162,487, filed on May 15, 2015, the benefit of priority of which areclaimed hereby, and which are incorporated by reference herein in theirentirety.

BACKGROUND

There are many applications where cooling is critical, such as, forexample, data centers. A data center usually consists of computers andassociated components working continuously (24 hours per day, 7 days perweek). The electrical components in a data center can produce a lot ofheat, which then needs to be removed from the space. Air-conditioningsystems in data centers can often consume more than 40% of the totalenergy.

With the current data centers' air-conditioning systems and techniquesand significant improvements in IT components operating conditions andprocessing capacity, servers can roughly operate at 50% of theircapacity. This capacity limitation is due, in part, to the coolingsystems not being able to cool the servers efficiently and the serversreach their high temperature limit before reaching their maximumcapacity. High density data center cooling seeks to cool servers moreeffectively and increase the density of the data centers. Consequently,this will result in savings in data center operating cost and willincrease the data center overall capacity.

The high density data center cooling can be achieved by using liquidcooling technologies to reject the heat at the server. Data centerliquid cooling affects the data center energy consumption in two ways:(1) utilizing maximum server processing capacity and data centerprocessing density which will result in lower cooling power consumptionper kW of processing power in the data center, and (2) generallyliquid-cooling systems are more energy efficient than data centersair-cooling systems. The liquid cooling technology can capture up to100% of the heat at the server which can eliminate the need for datacenters air-cooling systems. The data center liquid cooling can save upto 90% in data centers cooling costs and up to 50% in data centersoperating costs. Also, data center liquid cooling can increase theservers processing density by up to 100% which can result in significantsavings in the data center white space.

High density cooling for data centers can include liquid coolingtechniques which can use a special coolant and liquid circuit. Thecoolants can be expensive and as such, replacement of the coolant canalso be expensive. The coolant can pick up the heat from the server andthe heat can then be rejected to another liquid loop or cooling airstream. A cooling tower or outdoor dry cooler can be used to reject theheat from the coolant, but these may not be efficient. The water qualityin cooling towers which should flow into a liquid circuit to pick up theheat from the coolant should be maintained at a certain level and couldbecome a problem. The accumulation of dissolved minerals in thecirculating cooling water can lead to deposits and scaling on theexchange surfaces which reduces performance. Corrosion of metalcomponents and piping in cooling towers can be a common concern.

Overview

The present inventors recognize, among other things, an opportunity forimproved performance in cooling an enclosed space, or a device, using aLiquid-to-Air Membrane Energy Exchanger (LAMEE) as an evaporative coolerand using the reduced-temperature water from the LAMEE to provide liquidcooling to the enclosed space or the device. In an example, the enclosedspace can be a data center.

Examples according to the present application can include aliquid-cooling system which can reduce the data center cooling energyconsumption by up to 95% compared to conventional air cooling datacenters techniques. The liquid cooling system can be significantlysmaller in size and lighter compared to other direct evaporative coolers(DEC), including air-cooling DECs. The liquid-cooling system asdescribed herein can reduce the water consumption in comparison withother evaporative cooling systems and can reduce the operating cost ofthe data center by up to 60%.

Data centers liquid cooling can be much more efficient than data centersair cooling since a typical liquid, such as water, at the same volumeflow rate as air, has almost 350 times higher thermal capacity than theair. As such, the required water flow rate to reject a certain amount ofheat from an IT component can be almost 350 times lower than therequired air flow rate. Liquid (mainly water) can be cooled in a liquidto air membrane energy exchanger (LAMEE), also referred to herein as anexchanger. The LAMEE or exchanger can cool both outdoor (scavenger) airand liquid water, under some scavenger air conditions, to the outdoorair wet-bulb temperature. The reduced temperature water output from theLAMEE can be supplied to an enclosed space, such as, for example, a datacenter having IT components. The reduced temperature water can be storedin a tank prior to providing liquid cooling.

Examples according to the present application can include using a LAMEEin evaporative cooling and data centers liquid cooling applications,using water in a membrane exchanger for evaporative cooling and datacenters cooling, and using a liquid pre-cooler downstream of anevaporative LAMEE to increase the system efficiency and operate thesystem on economizer mode. Various system configurations can be used andcan include, but are not limited to, a liquid cooling coil upstream ordownstream of the LAMEE for high efficiency cooling applications.Examples according to the present application can include integratingthe LAMEE with current liquid cooling technologies available in themarket such as liquid cooling immersing technology and using cold platesat the server to reject heat.

Examples according to the present application can include integration ofa liquid cooling coil downstream of the LAMEE which can cool the hotwater before entering the LAMEE and can boost the system performance.Also, the liquid cooling coil can work as an economizer for the coolingsystem. Whenever the outdoor air is cold enough to cool the water to theset point temperature, water can bypass the exchanger and only passthough the cooling coil. The economizer mode can expand the life of theLAMEE and can save water since no water evaporates in the system oneconomizer mode.

Examples according to the present application can include a conditioningsystem for controlling conditions in an enclosed space. The conditioningsystem can include a cooling system disposed outside of the enclosedspace and having a scavenger air plenum configured to direct scavengerair in a flow path from an air inlet to an air outlet. A LAMEE can bearranged inside the plenum and can comprise a cooling fluid flow pathseparate from an air flow path by a membrane. The LAMEE can beconfigured to use the scavenger air to evaporatively cool a coolingfluid in the cooling fluid flow path and lower a temperature of thecooling fluid in the LAMEE. The conditioning system can include acooling fluid circuit connected to the cooling fluid flow path of theLAMEE and extending from the plenum into the enclosed space. The coolingfluid circuit can be used to deliver reduced temperature water from theLAMEE or a reduced temperature coolant to the enclosed space to providecooling to the enclosed space without moving air from the enclosed spacethrough the cooling system.

Examples according to the present application can include a conditioningsystem for controlling conditions in an enclosed space having a firstcooling system disposed outside of the enclosed space and a secondcooling system disposed inside the enclosed space. The first coolingsystem can include a scavenger air plenum configured to direct scavengerair in an air flow path from an air inlet to an air outlet and a LAMEEarranged inside the plenum. The LAMEE can include a water flow pathseparated from the air flow path by a membrane. The LAMEE can beconfigured to use the scavenger air to reduce a temperature of water inthe water flow path. The conditioning system can include a cooling fluidcircuit connected to the water flow path of the LAMEE and to the secondcooling system. The cooling fluid circuit can provide cooling to theenclosed space without moving air from the enclosed space through thefirst cooling system. The second cooling system can include directcooling, using water or a coolant in the cooling fluid circuit, to oneor more components in the enclosed space. The one or more components caninclude, but are not limited to, electrical components. The secondcooling system can include sensible cooling of air in the enclosed spaceusing water or a coolant in the cooling fluid circuit.

Examples according to the present application can include a conditioningsystem for controlling conditions in an enclosed space having a coolingsystem disposed outside of the enclosed space. The cooling system cancomprise a scavenger air plenum configured to direct scavenger air in anair flow path from an air inlet to an air outlet and a LAMEE arrangedinside the plenum in the air flow path. The LAMEE can comprise a coolingfluid flow path separated from the air flow path by a membrane. TheLAMEE can be configured to use the scavenger air to evaporatively cool acooling fluid in the cooling fluid flow path such that a temperature ofthe cooling fluid at a fluid outlet of the LAMEE is lower than atemperature of the cooling fluid at a fluid inlet of the LAMEE. Thecooling system can further comprise a first cooling unit arranged insidethe plenum between the air inlet and the LAMEE and configured tocondition the scavenger air prior to the scavenger air entering theLAMEE. The cooling system can further comprise a second cooling unitarranged inside the plenum between the LAMEE and the air outlet andconfigured to reduce a temperature of the cooling fluid before thecooling fluid enters the LAMEE at the fluid inlet. The cooling systemcan further comprise one or more bypass dampers configured to permitscavenger air to enter or exit the air flow path at one or morelocations between the air inlet and outlet. A cooling fluid circuit ofthe conditioning system can be connected to the cooling fluid flow pathof the LAMEE and extend from the plenum into the enclosed space. Thecooling fluid circuit can provide cooling to the enclosed space withoutmoving air from the enclosed space through the cooling system.

Examples according to the present application can include a conditioningsystem for providing cooling to a device that can be located either inan enclosed space or at a location open to the atmosphere. Theconditioning system can include the device to be cooled, in combinationwith a cooling system that is separate from and remote to the device tobe cooled. The cooling system can include a LAMEE for providingreduced-temperature water, and the reduced temperature water, or acoolant cooled by the reduced-temperature water, can be delivered to thedevice. The reduced temperature water or coolant can be used to providecooling to the device and the water or coolant can be recirculated backto the cooling system. The device can be any type of equipment orcomponent that generates heat or uses a liquid to reject heat.

This overview is intended to provide an overview of subject matter ofthe present patent application. It is not intended to provide anexclusive or exhaustive explanation of the invention. The detaileddescription is included to provide further information about the presentpatent application.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, which are not necessarily drawn to scale, like numeralsmay describe similar components in different views. Like numerals havingdifferent letter suffixes may represent different instances of similarcomponents. The drawings illustrate generally, by way of example, butnot by way of limitation, various embodiments discussed in the presentdocument.

FIG. 1 is a schematic of an example conditioning system for controllingconditions in an enclosed space, in accordance with the present patentapplication.

FIG. 2 is a schematic of an example conditioning system in accordancewith the present patent application.

FIG. 3 is a schematic of an example conditioning system in accordancewith the present patent application.

FIG. 4 is a schematic of an example conditioning system in accordancewith the present patent application.

FIG. 5 is a schematic of an example conditioning system in accordancewith the present patent application.

FIG. 6 is a schematic of an example conditioning system in accordancewith the present patent application.

FIG. 7 is a schematic of an example conditioning system in accordancewith the present patent application.

FIG. 8 is a schematic of an example cooling system in accordance withthe present patent application.

FIG. 9 is a schematic of an example cooling system in accordance withthe present patent application.

FIG. 10 is a schematic of an example cooling system in accordance withthe present patent application.

FIG. 11 is a schematic of an example conditioning system in accordancewith the present patent application.

DETAILED DESCRIPTION

The present application relates to systems and methods for controllingconditions inside an enclosed space, or providing cooling to a device,using a Liquid-to-Air Membrane Energy Exchanger (LAMEE) as anevaporative cooler for liquid-cooling. The LAMEE or exchanger can coolwater or both outdoor (scavenger) air and water to the outdoor air wetbulb temperature, depending in part on the air conditions. The reducedtemperature water from the exchanger can provide cooling to the enclosedspace or to the device. In an example, a cooling coil can be includedafter the exchanger to cool the hot return water from the enclosed spaceor the device, before the water is recycled to the exchanger. Thecooling coil can use the cold scavenger air exhausting from theexchanger to cool the return water. The cooling coil can boost theperformance of the system and can provide an economizer operating mode.In winter when the outdoor air is cold, the scavenger air can bypass theexchanger and pass directly through the cooling coil. The economizermode can bring more energy and water savings to the liquid-coolingsystem. In an example, a cooling coil can be included before theexchanger to cool the scavenger air prior to passing the scavenger airthrough the exchanger. The reduced temperature water from the exchangercan be delivered to the enclosed space or the device to provide directcooling to the enclosed space or the device. Alternatively, the reducedtemperature water can provide cooling to a coolant in a liquid to liquidheat exchanger (LLHX) and the reduced temperature coolant can bedelivered to the enclosed space or the device.

As described herein, a dry coil or cooling coil can be used upstream ofthe LAMEE or downstream of the LAMEE, or both. In some examples, thecooling coil can be referred to herein as a pre-cooling coil or apre-cooler if it is located upstream of the LAMEE. The pre-cooler can beused to cool the scavenger air before the scavenger air enters theLAMEE. In some examples, the cooling coil can be referred to herein asan economizer coil if it can be configured for cooling the water in aneconomizer mode in which the LAMEE is bypassed and the cooling coilprovides cooling to the return water. It is recognized that, in someexamples, the cooling coils described herein can be the same type ofcooling coil and have the same general design, regardless of whether thecooling coil is upstream or downstream of the LAMEE, or described as apre-cooler, an economizer coil or a dry coil. As described furtherbelow, in some examples a cooling coil can function in some modes (forexample, in summer) as a pre-cooler to the scavenger air and in othermodes (for example, in winter) that same cooling coil can switch itsfunction to be for cooling the increased-temperature water returning tothe system.

FIG. 1 depicts an example conditioning system 100 for providing coolingto a data center (or other enclosed space) 102. The conditioning system100 can include a scavenger air plenum 104 which can include an airinlet 106 and an air outlet 108 through which a scavenger air stream canflow. The plenum 104 can also be referred to as a housing, cabinet orstructure, and can be configured to house one or more components used tocondition air or water. The plenum 104 can be disposed outside of thedata center 102. The conditioning system 100 can include a liquid-to-airmembrane energy exchanger (LAMEE) 110, a dry coil (or cooling coil) 112,and a fan 114. The LAMEE 110 can also be referred to herein as theexchanger 110.

A liquid to air membrane energy exchanger (LAMEE) can be used as part ofa heating and cooling system (or energy exchange system) to transferheat and moisture between a liquid desiccant and an air stream tocondition the temperature and humidity of the air flowing through theLAMEE. In an example, the membrane in the LAMEE can be a non-porous filmhaving selective permeability for water, but not for other constituentsthat form the liquid desiccant. Many different types of liquiddesiccants can be used in combination with the non-porous membrane,including, for example, glycols. The non-porous membrane can make itfeasible to use desiccants, such as glycols, that had been previouslydetermined to be unacceptable or undesirable in these types ofapplications. In an example, the membrane in the LAMEE can besemi-permeable or vapor permeable, and generally anything in a gas phasecan pass through the membrane and generally anything in a liquid phasecannot pass through the membrane. In an example, the membrane in theLAMEE can be micro-porous such that one or more gases can pass throughthe membrane. In an example, the membrane can be a selectively-permeablemembrane such that some constituents, but not others, can pass throughthe membrane. It is recognized that the LAMEEs included in theconditioning systems disclosed herein can use any type of membranesuitable for use with an evaporative cooler LAMEE.

The LAMEE or exchanger 110 in the conditioning system 100 (as well asthe other exchangers disclosed in the examples of FIGS. 2-7 ) cancirculate a cooling fluid, which can be an evaporative fluid, throughthe LAMEE or exchanger 110 to reduce a temperature of the cooling fluid.The LAMEE or exchanger 110 can operate as an evaporative cooler, usingthe cooling potential in both air and the cooling fluid (for example,water) to reject heat. In an example, the LAMEE or exchanger 110 can usea flexible polymer membrane, which is vapor permeable, to separate airand water. The water flow rate through the LAMEE 110 may not be limited,compared to other conditioning systems, and the LAMEE 110 can operatewith water entering the LAMEE 110 at higher temperatures.

The cooling fluid circulating through the LAMEE or exchanger 110 caninclude water, liquid desiccant, glycol, other hygroscopic fluids, otherevaporative liquids, and/or combinations thereof. In an example, thecooling fluid is a liquid desiccant that is a low concentration saltsolution. The presence of salt can sanitize the cooling fluid to preventmicrobial growth. In addition, the desiccant salt can affect the vaporpressure of the solution and allow the cooling fluid to either releaseor absorb moisture from the air. The concentration of the liquiddesiccant can be adjusted for control purposes to control the amount ofcooling of the scavenger air or cooling fluid within the LAMEE orexchanger 110.

In an example, the cooling fluid in the LAMEE or exchanger 110 can bewater or predominantly water. In the conditioning system 100 of FIG. 1 ,as well as the conditioning systems of FIGS. 2-7 , the cooling fluid isdescribed as being water and the LAMEE or exchanger 110 can include awater inlet 116 and a water outlet 118 for passing water through theexchanger 110. The inlet 116 and outlet 118 can be described as acooling fluid inlet and a cooling fluid outlet since a fluid in additionto, or as an alternative to, water can circulate through the exchanger110. It is recognized that other types of evaporative cooling fluids,including those listed above, can be used in combination with water oras an alternative to water in the conditioning systems of FIGS. 1-7 .

The LAMEE or exchanger 110 can be referred to herein as an evaporativecooler and/or an evaporative cooler LAMEE. As scavenger air flowsthrough the exchanger 110, the water, or both the scavenger air and thewater, can be cooled to the outside air wet bulb (WB) temperature. Thescavenger air exiting the exchanger 110 can pass through the dry coil112 and the fan 114 and exit the plenum 104 at outlet 108 as exhaust.The dry coil 112 is discussed further below.

Due to the evaporative cooling process in the exchanger 110, atemperature of the water at the outlet 118 of the exchanger 110 can beless than a temperature of the water at the inlet 116. Thereduced-temperature water from the exchanger 110 can be used to providecooling to the data center 102. The exchanger 110 and other componentsinside the plenum 104, such as the dry coil 112, can be referred toherein as a cooling system 101. The cooling system 101 can be located ordisposed outside of the data center 102.

After exiting the exchanger 110, the reduced-temperature water can flowvia a water line 120 into a water tank 122. Although not shown in FIG. 1, the water tank 122 can include a make-up valve and a drain valve tomaintain the water level and hardness level inside the tank 122. Thewater tank 122 can include one or more temperature sensors in or aroundthe water tank 122 to monitor a temperature of the water in the tank122. In an example, a control of the conditioning system 100 can bebased, in part, on a measured temperature of the water in the tank 122compared to a setpoint water temperature. In an example, the setpointwater temperature can be pre-determined based on an estimated coolingload of the data center 102. In an example, the setpoint watertemperature can vary during operation of the conditioning system 100,based in part on operation of the data center 102.

The water from the water tank 122 can be pumped with a pump 124 to thedata center 102 via a water line 126. As described further below, thereduced-temperature water can provide cooling to the data center 102 bytransporting the water to the data center 102, eliminating the steps ofmoving hot supply air from the data center 102 through the coolingsystem 101 and then back to the data center 102. The reduced-temperaturewater can cool the data center 102 using any known methods to rejectheat from the data center 102, including but not limited to, liquidimmersing technology, cold plate technology, rear door heat exchangers,cooling distribution units (CDU), and cooling coils. In an example, thewater can directly cool one or more components in the data center 102.The one or more components can include, but are not limited to,electrical components. In an example, the water can pass through one ormore cooling coils placed in a path of the supply air in the data center102, and the water in the cooling coil can sensibly cool the supply air.See FIGS. 8-10 which are described below.

After the water provides cooling to the data center 102, the water canbe recirculated back to the exchanger 110. The water can be at anincreased-temperature when it exits the data center 102 because therejected heat from the data center 102 has been picked up by the water.The water can pass from the data center 102 to the dry coil 112 througha water line 128, and the dry coil 112 can cool the water before thewater is returned to the exchanger 110. The dry coil 112 can cool thewater using the cooling potential of the scavenger air. The scavengerair exiting the exchanger 110 can be relatively cool and additionalsensible heat from the water can be rejected into the scavenger air. Inother examples, the water can pass directly back to the exchanger 110rather than first passing through the dry coil 112.

The water can exit the dry coil 112 through a water line 130, which canbe split, using a bypass valve 132, into a water line 130 a to theexchanger 110 and a water line 130 b to the tank 122. The bypass valve132 can control how much of the water exiting the dry coil 112 is sentto the exchanger 110 and how much is sent to the tank 122.

In an economizer mode, the bypass valve 132 can be open such that all ofthe water from the dry coil 112 can bypass the exchanger 110 and godirectly to the tank 122. The economizer mode or winter mode can enablethe cooling system 101 to cool the water using the scavenger air and drycoil 112, without having to run the exchanger 110. In that situation,there may be no need for evaporation inside the exchanger 110 since thecold outdoor air (scavenger air) can pass through the dry coil 112 andcool the water. The dry coil 112 can also be referred to herein as aneconomizer coil since it can be a primary cooling source for the waterin the economizer mode.

The plenum 104 can include one or more bypass dampers 134 between theexchanger 110 and the dry coil 112. In the economizer mode, thescavenger air can also bypass the exchanger 110 by entering the plenum104, through the bypass dampers 134, downstream of the exchanger 110.This can protect the exchanger 110 and avoid running the exchanger 110when it is not needed. The cooling system 101 can modulate between anormal mode and an economizer mode to limit power consumption and basedon outdoor air conditions.

The reduced-temperature water from the exchanger 110 can be part of acooling fluid circuit that can extend from the plenum 104 and bedelivered to the data center 102. After the water provides cooling tothe data center 102, the water can be recirculated through the coolingsystem 101. The water tank 122 and the pump 124 can be considered to bepart of the cooling fluid circuit or the cooling system 101. One or bothof the tank 122 and pump 124 can be located physically in the plenum104, or one or both of the tank 122 and pump 124 can be physicallylocated in the data center 102. Alternatively, one or both of the tank122 and pump 124 can be located in a structure separate from the plenum104 or the data center 102.

Using a LAMEE in the cooling system 101 can offer advantages overconventional cooling systems, such as cooling towers, for example. Themembrane separation layer in the LAMEE can reduce maintenance, caneliminate the requirement for chemical treatments, and can reduce thepotential for contaminant transfer to the liquid loop. The use of LAMEEsalong with an upstream or downstream cooling coil can result in a lowertemperature of the water leaving the LAMEE and a higher coolingpotential. Various configurations of cooling systems having a LAMEE aredescribed herein and can boost performance in many climates. Highercooling potential and performance can result in lower air flow and fanpower consumption in the cooling system, which is the main source ofenergy consumption in liquid-cooling systems, and can increase theoverall data center cooling system efficiency.

The cooling system 101 can maximize the cooling potential in theexchanger 110 and modulate the scavenger air through the plenum 104based on the outdoor air conditions. The economizer mode, for example,in winter, can provide a reduction in water usage and power consumptioncompared to conventional cooling systems. The cooling system 101 can besmaller in size relative to conventional cooling systems, such as acooling tower having a similar cooling capacity. The cooling system 101can require less water treatment and water filtration compared toconventional cooling systems since the water and the scavenger air inthe exchanger 110 do not come into direct contact with each other.

The cooling system 101 can utilize reduced-temperature water to providecooling to a data center or other enclosed space. Thereduced-temperature water can be transported from the cooling system101, which is disposed outside of the data center 102, to the datacenter 102 or other enclosed space. In contrast, for existing aircooling designs, process air from the data center can be delivered tothe cooling system which can be configured as a larger unit for two airflow paths—the process air and the scavenger air. Thus more energy isused in those designs to move the process air from the data center tothe cooling system and then condition the process air. In the systemsdescribed herein, less energy by comparison can be used to deliver thereduced-temperature water from the cooling system to the data center.Moreover, water has a higher thermal capacity than air; thus a lowerflow rate of water can be used, compared to air, to reject a certainamount of heat directly from one or more electrical components in thedata center (or other components needing cooling) or from the air in thedata center.

The term “provide cooling to the enclosed space” as used herein refersto using the reduced-temperature water from the LAMEE or exchanger tocool the air in the enclosed space or to cool one or more components inthe enclosed space. The components within the space can be directlycooled (see FIGS. 8 and 9 ) with the reduced-temperature water or acoolant, the air around the components can be cooled (see FIG. 10 ), ora combination can be used. Although the present application focuses on adata center as the enclosed space, the systems and methods disclosedherein for cooling can be used in other examples of enclosed spaces,including for example, a telecommunication room, industrial applicationsand commercial spaces. The systems and methods disclosed herein can beused in any application using water for cooling and then a coolingtower, or any application using dry coolers in combination with asupplemental heat rejection system for high scavenger air dry bulbtemperatures.

FIGS. 2-7 illustrate various configurations of conditioning systems thatcan have alternative or additional components, compared to theconditioning system 100 of FIG. 1 , in combination with a LAMEE. Aparticular configuration can be selected based in part on the coolingload of the enclosed space and a pre-determined temperature of the water(or coolant) to be delivered to the enclosed space to meet the coolingload. For example, in an application requiring that very cold water orcoolant be provided to the enclosed space to meet the cooling load, apre-cooler can be included in the conditioning system. In other examplesin which it may be sufficient to provide a higher-temperature water orcoolant (relative to the application described immediately above) to theenclosed space, the pre-cooler may not be needed to meet the coolingload of the enclosed space.

A control system for the conditioning systems is described further belowin reference to the system 500 of FIG. 5 . It is recognized that asimilar control system could be used for the other conditioning systemsdescribed herein and shown in FIGS. 1-4 and 6-7 . A goal of theconditioning systems is to provide sufficient cooling to the data centeror other enclosed space using less water and less energy. The use of aLAMEE as an evaporative cooler to produce cold water outside of theenclosed space and delivering the cold water (or coolant) to theenclosed space can provide water savings, as compared to other liquidcooling technologies, and energy savings, as compared to other existingair cooling technologies.

FIG. 2 depicts an example conditioning system 200 that can be similar tothe system 100 of FIG. 1 . The system 200 can include an exchanger 210and a cooling unit or dry coil 212 located in a scavenger air plenum204, which together can form a cooling system 201. The cooling system201 can operate in a normal mode or an economizer mode, as describedabove in reference to the cooling system 101, to provide cooling to adata center 202. Instead of delivering water from a tank 222 to the datacenter 202, the water can be pumped, using a pump 224, through a waterline 240 to a liquid to liquid heat exchanger (LLHX) 242.

A coolant can enter the LLHX 242 through an input line 244 and exit theLLHX 242 through an output line 246. The coolant can be any suitablecoolant used to provide direct cooling to one or more components in thedata center 202 or to provide sensible cooling to supply air or datacenter air in the data center 202. In an example, the coolant caninclude anti-freeze to minimize the risk of the coolant freezing in thewinter.

The lines 244 and 246 can be fluidly connected to the data center 202such that the coolant exiting the LLHX 242 in the line 246 can bedelivered to the data center 202. After providing cooling to the datacenter 202, the higher-temperature coolant can be recirculated backthrough the LLHX 242 via the line 244. The reduced-temperature waterfrom the tank 222 can cool the higher-temperature coolant in the LLHX242 such that the coolant can exit the LLHX 242 at a lower temperatureand be returned to the data center 202. The higher-temperature waterexiting the LLHX 242 can be delivered to the dry coil 212 through awater line 248. The water can be cooled in the dry coil 212 and returnedto the exchanger 210 or the tank 222 as described above in reference tothe system 201 of FIG. 1 .

In the conditioning system 200, the reduced-temperature water from theexchanger 210 can cool the coolant and the coolant can provide coolingto the data center 202. This secondary coolant loop through the LLHX 242can protect the components in the data center 202 from deposition causedby water hardness. The selected coolant can have anti-corrosionadditives to protect metal components from corrosion. A selectionbetween a cooling system using water to provide direct cooling to thedata center (FIG. 1 ) and a cooling system having a secondary coolingloop (FIG. 2 ) can depend, in part, on the requirements of the datacenter (or other enclosed space), the type of equipment in the datacenter, and the type of cooling system used within the data center 202.A variety of methods can be used to reject heat from the data center 202using either water or a coolant. This is described further below inreference to FIGS. 8-10 .

The LLHX 242 can be located physically in the plenum 204 or the LLHX 242can be located in the data center 202. If the LLHX 242 is located in thedata center 202 and the tank 222 is located outside the data center 202,the pump 224 can pump the water through the line 240 to the data center202. Alternatively, the LLHX 242 can be in a structure separate from theplenum 204 or the data center 202, and in that case, the tank 222 can belocated in the same or a different location from the LLHX 242.

FIG. 3 depicts an example conditioning system 300 having a coolingsystem 301 for providing cooling to a data center (or other enclosedspace) 302. The cooling system 301 can be similar to the system 201 ofFIG. 2 and can include a secondary coolant loop having an LLHX 342. Thesystem 300 can additionally include a direct expansion (DX) cooling coil350 in a water tank 322.

The DX coil 350 can be used to provide additional cooling to the waterin the tank 322 such that lower-temperature water can be provided to theLLHX 342. In an example, the DX coil 350 can be used to pre-cool waterin the tank 322 before or during start-up of the cooling system 301. Arefrigerant loop 352 can be included in the cooling system 301 to coolthe refrigerant exiting the DX coil 350. The refrigerant loop 352 caninclude a compressor 354, a condenser coil 356, and an expansion valve358. The condenser coil 356 can be located inside the scavenger airplenum 304. Scavenger air passing through the condenser coil 356 cancool the refrigerant. The cooled refrigerant can then be recirculatedback through the DX coil 350 in the tank 322. As shown in FIG. 3 , thescavenger air passes through the fan 314 and then the condenser coil356. In other examples, the order of the fan 314 and the condenser coil356 in the plenum 304 can be reversed.

It is recognized that a DX coil can be used in the water tank of any ofthe other cooling systems described herein, including the coolingsystems of FIGS. 1 and 4-7 . Other types of mechanical cooling means canbe used in addition to, or as an alternative to, the DX coil 350 to coolthe water in the tank 322 and such cooling means can be located insideor outside of the tank 322. For example, a liquid to refrigerant heatexchanger, located outside of the tank 322, can use a refrigerant tocool the water from the tank 322 before the water is directed to theLLHX 342. In that case, the increased-temperature refrigerant can passthrough the compressor 354, condenser coil 356 and expansion valve 358,as shown in FIG. 3 . In an example, a chilled water coil can be used inthe water tank and the chilled water can be provided using a chiller, inwhich case a compressor, condenser coil and expansion valve for arefrigerant would not be needed. If the data center 302 or enclosedspace has a chiller on site, this can be an effective option forproviding additional cooling to the water in the tank 322.

In an example, a thermal storage tank can be used in the cooling system301 (or any of the conditioning systems described herein) in combinationwith the tank 322. The thermal storage tank can provide a stand-bycooling option for the water from the tank 322, for example, during ashut-down of the system 301. The water from the tank 322 can be drainedinto the thermal storage tank.

FIG. 4 depicts an example conditioning system 400 having a coolingsystem 401 for providing cooling to a data center (or other enclosedspace) 402. The cooling system 401 can be similar to the system 201 ofFIG. 2 and can include an exchanger 410 and a secondary coolant loophaving an LLHX 442. Instead of having a dry coil located downstream ofthe exchanger 410 (see the dry coil 212 of FIG. 2 ), the cooling system401 can include a dry coil or pre-cooler coil 460 (also referred to as apre-cooling coil or a pre-cooler) upstream of the exchanger 410. Afilter 409 can be arranged inside the plenum 404 near an air inlet 406.It is recognized that a filter can similarly be included in the plenumof the other conditioning systems of FIGS. 1-3, 5 and 6 .

In the design shown in FIG. 4 , an input line 462 to the pre-cooler 460can carry the water from the LLHX 442. The pre-cooler 460 can beeffective when the temperature of the water entering the pre-cooler 460is lower than the outdoor air dry bulb temperature. The cooling system401 can be used in typical summer conditions as well as extreme summerconditions when the outdoor air can be very hot and humid. Thepre-cooler 460 can depress the outdoor air dry bulb temperature, thuspre-cooling the scavenger air passing through the pre-cooler 460 andheating the water in the pre-cooler 460. The scavenger air and the watercan then pass through the exchanger 410 as described above, in whichcase evaporation occurs and water or both the air and water can becooled to the outdoor air wet bulb temperature. This can be referred toas a summer mode or a normal operating mode when the scavenger air andwater are passing through the pre-cooler 460 and the exchanger 410.

If the outdoor air is cold, such as in winter, the cooling system 401can operate in an economizer mode or winter mode as similarly describedabove in reference to FIG. 1 . Because the scavenger air is cold, thescavenger air can cool the water as the scavenger air passes through thepre-cooler 460. In that case, the pre-cooler 460 is not providingcooling to the scavenger air as described above, but rather thepre-cooler 460 can use the cold scavenger air to cool the water from theline 462 such that the water can exit the pre-cooler 460 at a reducedtemperature and be recirculated back to the tank 422, without having tobe cooled in the exchanger 410.

The water can exit the pre-cooler 460 through a water line 464 that canbe split, as described above in reference to FIG. 1 , using a valve 466.The valve 466 can control the flow of water to the exchanger 410,through line 464 a, and to the tank 422, through line 464 b. During theeconomizer mode, all or a majority of the water in the line 464 can besent to the tank 422 since the water can be cooled in the pre-cooler 460and the exchanger 410 may not be needed. During warm outdoor airconditions, all or a majority of the water in the line 464 can be sentto the exchanger 410 since the pre-cooler 460 in that situation isfunctioning as a cooling coil for the scavenger air.

The plenum 404 can include an air bypass 468 having dampers 470. Thebypass 468 can allow the scavenger air to bypass the exchanger 410 in aneconomizer mode when the exchanger 410 is not being used. The scavengerair can then pass through the fan 414 and then exit at the scavenger airoutlet 408 as exhaust air. Alternatively, dampers similar to dampers 134shown in FIG. 1 can be used such that the scavenger air can exit theplenum 404 at a location between the pre-cooler 460 and the exchanger410.

In both summer and winter modes, the scavenger air can modulate tocontrol power consumption. The scavenger air flow rate can depend, inpart, on the outdoor air conditions and the location where the plenum404 is installed.

In other examples, the cooling system 401 can exclude the LLHX 442 andwater from the tank 422 can be delivered directly to the data center 402as described in reference to the cooling system 101 of FIG. 1 .

In other examples, the cooling system 401 can include a DX coil insidethe tank 422, as well as the other components of the refrigerant loopfor the DX coil (see FIG. 3 ). A cooling system having the pre-cooler460, as shown in FIG. 4 , in combination with a DX coil inside the tank422 can be used in extreme outdoor air conditions. If the temperature inthe tank 422 is higher than the setpoint temperature (to cover 100% ofthe load), a DX coil in the tank 422 can cool the water in the tank 422to the setpoint temperature. Thus the DX coil can provide additionalcooling of the water leaving the tank 422 so that the water 422 can besufficiently cool to cover the load for the data center 402. Duringother outdoor air conditions, a DX coil in the tank 422 may not beneeded to cover the load. In winter or during an economizer mode, such acooling system (the cooling system 401 with a DX coil inside the tank422) can have an air bypass similar to the air bypass 468 shown in FIG.4 and such bypass may extend past the condenser for the refrigerant loopso that the scavenger air can bypass the exchanger and the condenser,pass through the fan and exit the plenum. Alternatively, as describedabove, bypass dampers can be used to direct the scavenger air out of theplenum at a location between the pre-cooler 460 and the exchanger 410.

FIG. 5 depicts an example conditioning system 500 having a coolingsystem 501, which is similar to the cooling system 101 of FIG. 1 , forproviding cooling to a data center 502 or other enclosed space. Thecooling system 501 can also include a pre-cooler or dry coil 560 (alsoreferred to as a pre-cooling coil or a pre-cooler coil) inside theplenum 504 such that the system 501 includes a first cooling unit(pre-cooler 560) upstream of an exchanger 510 and a second cooling unit(dry coil 512) downstream of the exchanger 510. The dry coil 512 can besimilar to the dry coils 112, 212 and 312 of FIGS. 1, 2 and 3 ,respectively. The pre-cooler 560 can be similar to the pre-cooler 460 ofFIG. 4 .

As described above in reference to other cooling system examples, thedry coil 512 can effectively cool the higher-temperature water using therelatively cool scavenger air exiting the exchanger 510. The pre-cooler560 can be used in humid or extreme outdoor air conditions to conditionthe scavenger air prior to passing the scavenger air through theexchanger 510. The pre-cooler 560 can depress the outdoor air wet bulbtemperature to provide more cooling potential in the exchanger 510.

A flow path of the reduced-temperature water from the exchanger 510 andthe dry coil 512 to the tank 522 can be similar to the description abovein reference to FIG. 1 . A flow path of the increased-temperature waterfrom the data center 502 to the dry coil 512 can be similar to thedescription above in reference to FIG. 1 . The reduced-temperature watercan leave the tank 522 through two different water lines. A first pump524 can pump water from the tank 122 to the data center 502 through awater line 526. A second pump 572 can pump water from the tank 122 tothe pre-cooler 560 through a water line 574. In other examples, onewater line and one pump can be used to deliver water out of the tank 522and a split valve can be used to control the delivery of water to thedata center 502 and to the pre-cooler 560. (See FIG. 6 .)

The plenum 504 can include two sets of bypass dampers—first dampers 576between the pre-cooler 560 and the exchanger 510, and second dampers 534between the exchanger 510 and the dry coil 512. The use of the bypassdampers 576 and 534 to direct the flow of scavenger air into the plenum504 can depend on the outdoor air conditions. Although the first andsecond bypass dampers 576 and 534 are each shown as having a pair ofdampers on opposing sides of the plenum 504, it is recognized that oneor both of the first 576 and second 534 bypass dampers can be a singledamper on one side of the plenum 504.

The cooling system 501 can operate in three modes and selection of themode can depend, in part, on the outdoor air conditions and a coolingload of the data center 502. When the outdoor air is cold, the coolingsystem 501 can operate in a first mode, an economizer mode, and thepre-cooler 560 and the exchanger 510 can be bypassed. The scavenger aircan enter the plenum 504 through dampers 534 and pass through the drycoil 512. In a second operating mode, which can also be referred to as anormal mode or an evaporation mode, the pre-cooler 560 can be bypassed.The evaporation mode can operate during mild conditions, such as springor fall when the temperature or humidity is moderate, as well as somesummer conditions. The scavenger air may be able to bypass thepre-cooler 560, while still meeting the cooling load. The scavenger aircan enter the plenum 504 through dampers 576, and then can pass throughthe exchanger 510 and the dry coil 512. In a third operating mode, whichcan also be referred to as an enhanced mode or a super evaporation mode,the cooling system 501 can run using both the pre-cooler 560 and the drycoil 512. Under extreme conditions, or when the outdoor air is hot orhumid, the cooling system 501 can provide pre-cooling to the scavengerair, using the pre-cooler 560, before the scavenger air enters theexchanger 510. The pre-cooler 560 can be used to improve the coolingpower of the system 501, allowing the exchanger 501 to achieve lowerdischarge temperatures at the outlet 518 of the exchanger 510. Thepre-cooler 560 can reduce or eliminate a need for supplementalmechanical cooling.

The flow of water into the exchanger 510 through a water inlet 516 canalso depend on an operating mode of the cooling system 501. Similar tothe cooling systems described above, the water exiting the dry coil 512through a water line 530 can be split into a water line 530 a to theexchanger 510 and a water line 530 b to the tank 522, depending onwhether the cooling system 501 is operating in the economizer mode. Abypass valve 532 can control the flow of water from the dry coil 512 tothe tank 522 and the exchanger 510. The water exiting the pre-cooler 560can be directed to the inlet 516 of the exchanger 510 through a waterline 578. A junction 580 of the water lines 578 and 530 a is shown inFIG. 5 . It is recognized that the water lines 578 and 530 a do not haveto merge or join together prior to the inlet 516 and two separate waterlines can be in fluid connection with the inlet 516.

The conditioning system 500 can include a control system to controloperation of the cooling system 501 and control an amount of coolingprovided from the cooling system 501 to the data center 502. Suchcontrol system can be manual or automated, or a combination of both. Theconditioning system 500 can be operated so that a temperature of thewater in the tank 522 can be equal to a setpoint temperature that can beconstant or variable. In a conditioning system 500 including a LLHX anda secondary coolant loop, the conditioning system 500 can be operated sothat a temperature of the coolant leaving the LLHX (see, for example,the line 446 of FIG. 4 ) can be equal to a setpoint temperature that canbe constant or variable. Controlling to the temperature of the coolantcan be in addition to or as an alternative to controlling to thetemperature of the water in the tank 522 or the water leaving the tank522. The setpoint temperature can be determined based in part on thecooling requirements of the data center 502. The cooling system in thedata center 502 can use the water or coolant delivered to the datacenter 502 from the cooling system 501 to cool the air in the datacenter 502 or to cool one or more electrical components in the datacenter 502. The conditioning system 500 can be controlled to reduceoverall water usage and power consumption, and increase heat rejectionfrom the data center 502.

Operation of the conditioning system 500 can be aimed at increasing theportion of sensible heating between the water and the scavenger air anddecreasing the portion of latent heating between the water and thescavenger air. Water evaporation inside the LAMEE or exchanger 510 canbe optimized to minimize water consumption in the cooling system 501 byat least one of using cooling coils before or after the exchanger 510and modulating a scavenger air flow rate through the system 501. Agreater portion of the heat load can be rejected in the dry coil 512downstream of the exchanger 510, if the water returning to the system501 is at a higher temperature. As a result, the scavenger airtemperature at an outlet of the dry coil 512 can be higher. The LAMEE510 can consume less water when the latent portion of the work performedin the LAMEE is reduced.

In an example, the cooling system 501 can be operated in an economizermode in which the LAMEE 510 is turned off and bypassed so long as thesetpoint temperature of the water delivered to the tank can be met usingthe dry coil 512. However, if the water in the tank is at a temperatureabove the setpoint, the cooling system 501 can be operated in a normalmode which includes using the LAMEE 510 to cool the water. Similarly, ifthe setpoint temperature cannot be achieved in the normal mode, anenhanced mode can include using the pre-cooler 560 to condition thescavenger air before the scavenger air enters the LAMEE 510.

Other conditioning systems described herein and shown in FIGS. 1-4 and6-7 can similarly include a control system for operating the coolingsystems.

In other examples, the cooling system 501 could include a LLHX as partof a secondary coolant loop such that a coolant provides the cooling tothe data center 502. In other examples, the cooling system 501 caninclude a DX coil inside the tank 522.

In an example, a conditioning system can include multiple coolingsystems that can be similar to the cooling system 501 or any of theother cooling systems described herein and shown in FIGS. 1-4 and 6-7 .Multiple cooling systems can produce reduced-temperature water streams,which can be delivered to a master storage tank. Operation of themultiple cooling systems can depend in part on a temperature of thewater in the master tank. In an example, the cooling systems may beconfigured to operate more during the night when the outdoor air iscooler or operate more at certain periods in the day based on thecooling loads of the data center 502 or other enclosed space. Theconditioning systems described herein and shown in FIGS. 1-7 can be wellsuited for enclosed spaces that have a continuous cooling load or avariable cooling load.

FIG. 6 depicts an example conditioning system 600 having a coolingsystem 601 for providing cooling to a data center (or other enclosedspace) 602. The cooling system 601 can be similar to the cooling system401 of FIG. 4 in that a dry coil/pre-cooler 660 can be arranged inside aplenum 604 upstream of an exchanger 610. However, in contrast to thecooling system 401 in which the pre-cooling coil 460 can receive theincreased-temperature water from the LLHX 442 (or from the data center402), the pre-cooler 660 can receive the reduced-temperature water fromthe tank 622. The water can exit the tank 622 through a water line 682using a pump 624. A bypass valve 684 can split the water from the waterline 682 into a water line 682 a to the pre-cooler 660 and a water line682 b to the data center 602. In other examples, the water line 682 bcan pass to a LLHX that is part of a secondary coolant loop such that acoolant can be cooled with the water and the coolant can then bedelivered to the data center 602.

The water exiting the pre-cooler 660 can pass back through the exchanger610 via a water line 688. A valve 690 can control a flow of water fromthe pre-cooler 660 and from the data center 602 into the exchanger 610at inlet 616. Water from the data center 602 can go directly back to theexchanger 610 through a water line 686. As such, theincreased-temperature water can be returned to the exchanger 610 withouthaving any pre-cooling performed on the increased-temperature water. Theincreased-temperature water entering the exchanger 610 can produce highevaporation rates (a significant amount of heat can be rejected aslatent heat). The relative water consumption of the system 601 can behigher compared to other cooling system designs. The size of the system601 can be more compact and require less scavenger air flow for the sameamount of heat rejection, compared to other cooling system designs.

In the design of the cooling system 601 in which the water from the tankis split into lines 682 a and 682 b, the bypass valve 684 can be used tocontrol what portion of the water goes to the pre-cooling coil 660 andwhat portion goes to the data center 602. The splitting ratio can bevaried to control the mass flow rate to each of the pre-cooler 660 andthe data center 602. This can enable the coldest-temperature water inthe system 601 (from the tank 622) to go to the pre-cooling coil 660,maximizing its ability to lower the wet bulb temperature of thescavenger air and depress achievable cooling temperatures of the waterin the exchanger 610 as much as possible. If colder water is sent to thepre-cooler 660, the pre-cooler 660 can further cool the scavenger airentering the plenum 604, providing greater potential for evaporationinside the exchanger 610. If the pre-cooler 660 is not needed in orderfor the water in the tank 622 to meet the setpoint temperature (and thusmeet the cooling load of the data center 602), essentially all of thewater exiting the tank 622 can be delivered to the data center 602through the line 682 b.

It is recognized that this control of the water distribution between twoor more water lines can also be used in any of the other cooling systemdesigns, including the system 500 of FIG. 5 in which two water lines(520 and 574) are shown exiting the tank 522.

The plenum 604 can include one or more bypass dampers 634 which can beused to direct the scavenger air into the plenum 604 at a locationdownstream of the pre-cooling coil 660.

In other examples, the cooling system 601 can include a DX coil insidethe tank 622 to provide additional cooling to the water in the tank 622.

FIG. 7 depicts an example conditioning system 700 having a coolingsystem 701 for providing cooling to a data center (or other enclosedspace) 702. The cooling system 701 can be similar to the cooling system401 of FIG. 4 and can include an exchanger 710 and a pre-cooling coil orpre-cooler 760 located upstream of the exchanger 710. The system 701 canalso include an air-to-air heat exchanger (AAHX) 707, which can include,but is not limited to, a heat wheel, heat pipe, cross flow flat-plateAAHX or counter flow flat-plate AAHX.

The scavenger air can enter the plenum 704 at a scavenger air inlet 706,pass through a filter 709 and then pass through the AAHX 707. Thescavenger air can be indirectly and sensibly cooled in the AAHX 707using the scavenger air exiting the exchanger 710. The cooling systemdesign of FIG. 7 can be used for hot or humid outdoor air conditions toeliminate or reduce a need for additional DX cooling to precool thescavenger air entering the plenum 704.

After the scavenger air exits the AAHX 707, the scavenger air can passthrough the pre-cooler 760 in a second stage of cooling the scavengerair, in which the wet bulb temperature of the air can be furtherdepressed, thereby increasing the cooling potential in the exchanger710. After the scavenger air exits the exchanger 710 at a reducedtemperature, the cold air can pass through a fan 714 and the AAHX 707 tocool the outside air entering the plenum 704 at the scavenger air inlet706. The scavenger air can then exit the plenum 704 as exhaust air atthe scavenger air outlet 708.

A flow path of the water through the system 701 can be similar to theconfiguration in the cooling system 401 of FIG. 4 . A bypass valve 766can be used to control the flow of water from the pre-cooler 760 to thetank 722 (via a line 464 a) and to the exchanger 710 (via a line 464 b),depending in part on the outdoor air conditions and the operating modeof the system 701.

In mild conditions or in winter, some or essentially all of the waterexiting the pre-cooler 760 can be directed back to the tank 722 and thewater may not pass through the exchanger 710. In those conditions, theAAHX 707 can also be turned off, in which case the scavenger air canstill enter the plenum 704 at the inlet 706, or the AAHX 707 can bebypassed by directing the scavenger air into the plenum 704 throughbypass dampers 792 between the AAHX 707 and the pre-cooler 760. In somecases, the scavenger air can still pass through the exchanger 710 evenif water is not being circulated through the exchanger 710, and thescavenger air can exit the plenum through bypass dampers 794 locateddownstream of the fan 714 and before the AAHX 707. In other designs, thefan 714 can be in a different location within the plenum 704. In anexample, the fan 714 can be moved upstream of the pre-cooler 760 and theexchanger 710, and a bypass could be included after the fan 714 fordirecting the scavenger air out of the plenum 714.

In an example, the outdoor air conditions can be such that the AAHX 707can be used for cooling the scavenger air entering the plenum 704 andthe pre-cooler coil 760 can be bypassed by one or both of the air andthe water. It is recognized that various configurations of dampers andbypasses can be included in the cooling system 701 to improve energyefficiency and operation of the system 701 depending on the outdoor airconditions.

In other examples, the cooling system 701 can eliminate the LLHX 742 andthe reduced-temperature water can be delivered directly from the tank722 to the data center 702.

Various configurations of cooling systems having a LAMEE and othercomponents arranged inside a scavenger air plenum are described aboveand illustrated in FIGS. 1-7 . Any of the configurations described abovecan use the water to provide cooling to the data center or any of theconfigurations described above can include a secondary coolant loop touse the cold water to cool a coolant which can be delivered to the datacenter. It is recognized that some of the components in the coolingsystem do not have to be arranged in the specific manner illustrated inthe figures and alternative configurations are included in the scope ofthe present application. For example, a fan can be located upstream ordownstream of the exchanger, a fan can be located upstream or downstreamof a condenser coil that is part of a refrigerant loop. A filter isincluded in the cooling systems 401 and 701 of FIGS. 4 and 7 ,respectively (see filters 409 and 709). It is recognized that a filtercan be included near an inlet of any of the plenums of the other coolingsystems of FIGS. 1-3, 5 and 6 . It is recognized that additionalcomponents can be included in the cooling systems described above andillustrated in FIGS. 1-7 . In an example, any of the conditioningsystems of FIGS. 1-7 can include a water treatment device which cancontrol a quality of the water circulating through the conditioningsystems.

As described above, reduced-temperature water from a LAMEE can be usedto provide cooling to a data center or other enclosed space. Thereduced-temperature water can be delivered to the enclosed space or thereduced-temperature water can cool a coolant in a secondary coolant loopsuch that the coolant can be delivered to the enclosed space. The wateror coolant can cool the enclosed space using any known methods forrejecting heat from the space with a liquid (water or coolant). FIGS.8-10 illustrate examples of cooling systems that can be used to cool theenclosed space. It is recognized that a combination of cooling systemscan be used inside the enclosed space.

FIG. 8 depicts an example cooling system 800 that can be located insidea data center 802 or other enclosed space. The cooling system 800 canuse immersing technology to provide liquid cooling to IT equipment orelectrical components 804 that can be immersed in a liquid bath 806. Theliquid bath 806 can be formed of coolant from a secondary coolant loophaving a LLHX in which the coolant can be cooled usingreduced-temperature water from any of the cooling systems in FIGS. 1-7described above using a LAMEE. The coolant can enter the liquid bath 806at an inlet 808 to provide cooling to the components 804 immersed in thecoolant and can reject essentially 100% of the heat from the components804. The coolant can exit the liquid bath 806 at an outlet 810 at anincreased temperature, relative to a temperature at the inlet 808. Thecoolant can be circulated back to the LLHX in the secondary coolant loopsuch that the reduced-temperature water passing through the LLHX cancool the coolant for delivery back to the cooling system 800.

The cooling system 800 is shown in FIG. 8 having four electricalcomponents 804. It is recognized that more or less electrical components804 can be cooled in the cooling system 800. In an example, the datacenter 802 can contain multiple cooling systems 800, each of which maycool a plurality of electrical components 804. The coolant delivered tothe data center 802 can come from a single cooling system describedabove and shown in FIGS. 1-7 and such cooling system can have sufficientcooling capacity to provide cooling across the multiple cooling systems800. Alternatively, the coolant to the data center 802 can be frommultiple cooling systems selected from any of the designs describedabove and shown in FIGS. 1-7 , each of which has a LAMEE in combinationwith other components to produce cold water.

In an example, the coolant in the liquid bath 806 can be a specificnon-conductive liquid with high thermal capacity and have propertiessufficient to satisfy requirements for liquid immersing technologies.

FIG. 9 depicts an example cooling system 900 that can be located insidea data center 902 or other enclosed space. The cooling system 900 canuse cold-plate technology to provide liquid cooling to IT equipment orelectrical components 904 inside the data center 902.

In an example, cold water from the cooling systems described above andshown in FIGS. 1-7 can be delivered from the storage tank to the datacenter 902 and distributed to each of the electrical components 904. Thewater can pass through microchannels in a cold plate 912 that isattached to and in direct contact with each of the electrical components904. The water can pick up a portion of the heat from the electricalcomponents 904 such that a temperature of the water at an outlet 916 ofeach plate 912 is higher than a temperature of the water at an inlet 914of each plate 912. The increased-temperature water can then be returnedto the cooling system and recirculated back through the cooling systemas described above and shown in FIGS. 1-7 .

In an example, a coolant can be delivered to the data center 902 anddistributed to each of the electrical components 904. The coolant can beany suitable coolant for circulation through the cold plates 912. Thecoolant can be cooled in a secondary coolant loop prior to beingdelivered to the data center 902 as described above. After the coolantpasses through the cold plates 912, rejecting heat from the components904, the increased-temperature coolant can be returned to a LLHX in thesecondary coolant loop such that the coolant can be cooled back down forrecirculation back to the cooling system 900.

If water is used in the cooling system 900, in an example, the water mayneed to be treated prior to passing the water through the cold plates912 to ensure the water is sufficiently clean. An air cooling system canalso be used to provide cooling to the data center 902 since the coolingsystem 900 may not be able to reject 100% of the heat from theelectrical components 904.

The cooling system 900 is shown in FIG. 9 having three electricalcomponents 904, each with a cold plate 912. It is recognized that moreor less electrical components 904 can be cooled in the cooling system900. In an example, the data center 902 can contain multiple coolingsystems 900, each of which may cool a plurality of electrical components904. The water or coolant delivered to the data center 902 can come froma single cooling system described above and shown in FIGS. 1-7 and suchcooling system can have sufficient cooling capacity to provide coolingacross the multiple cooling systems 900. Alternatively, the water orcoolant can from multiple cooling systems selected from any of thedesigns described above and shown in FIGS. 1-7 , each of which has aLAMEE in combination with other components to produce cold water orcoolant.

FIG. 10 depicts an example cooling system 1000 that can be locatedinside a data center 1002 or other enclosed space. The cooling system1000 can use a cooling coil 1018 to provide cooling to the air in thedata center 1002. The cold water or coolant from any of the coolingsystems of FIGS. 1-7 can flow through the cooling coil 1018. As the datacenter air flows over the cooling coil 1018, the data center air can besensibly cooled by the water or coolant in the coil 1018. As such, atemperature of the data center air downstream of the cooling coil 1018can be less than a temperature of the data center air upstream of thecooling coil 1018. The temperature of the water or coolant at an outlet1020 of the coil 1018 can be greater than a temperature of the water orcoolant at an inlet 1022 of the coil 1018. The increased-temperaturewater or coolant exiting the cool 1018 can be returned to the coolingsystem and recirculated back through the cooling system as describedabove and shown in FIGS. 1-7 .

The cooling coil 1018 can be configured in the data center 1002 in anynumber of ways. The data center 1002 can include one or more coolingcoils 1018 depending on the cooling capacity of the coil 1018 and thecooling load in the data center 1002. In an example, the cooling coil1018 can be configured as a rear door heat exchanger and attach to theback of a component, including, for example, an electrical component inthe data center 1002. The data center air can pass through one or morecomponents in a cabinet and the data center air can pick up the heatfrom the components. The increased temperature air can then pass throughthe rear door heat exchanger, where cooling of the air can occur, andthen exit the cabinet. In an example, the cooling coil 1018 can bepositioned above one or more electrical components and the data centerair can be directed up to the cooling coil 1018.

In examples, a data center or enclosed space can have multiple coolingsystems, including any combination of those shown in FIGS. 8-10 . Thewater or coolant supplied to the data center can come from multiplecooling systems including any combination of those shown in FIGS. 1-7 ora single cooling system selected from any of those shown in FIGS. 1-7can be used to provide cooling to the data center.

FIG. 11 depicts an example conditioning system 1100 for providingcooling to a device 1102. The conditioning system 1100 can include acooling system 1101 that can be similar to any of the cooling systems101, 201, 301, 401, 501, 601, and 701 of FIGS. 1-7 and can include aLAMEE, and any of the other components and features described above incombination with the LAMEE, to form the cooling system 1101.

The cooling system 1101 can produce reduced-temperature water orcoolant, using an evaporative cooler LAMEE, and the reduced-temperaturewater or coolant can be delivered to the device 1102 to be cooled. Thecooling system 1101 can be located separate from and remote to thedevice 1102 and the reduced-temperature water or coolant can betransported or delivered to the device 1102. In an example, the device1102 is not in an enclosed space, such that the device 1102 can be opento the atmosphere and an exterior of the device 1102 can be exposed tooutdoor air. The example conditioning system of FIG. 11 is thusdistinguished from previous examples in that the conditioning products(water or other fluid coolant) of the cooling system 1101 can bedelivered to a device or other piece of equipment or system that is notarranged within an enclosed space.

The conditioning system 1100 can be configured such that thereduced-temperature water or coolant from the cooling system 1101 can bedelivered to an inlet 1104 of the device 1102 at an inlet temperature.The cooling liquid can reject heat from the device 1102 such that thewater or coolant leaving the device at an outlet 1106 can be at anoutlet temperature that is higher than the inlet temperature. Theincreased-temperature liquid exiting the device 1102 can be recirculatedback to the cooling system 1101 where the water or coolant can be cooledagain, as described above.

The device 1102 can include any type of equipment or component thatgenerates heat or any type of equipment or component that uses a fluidfor heat rejection. The reduced-temperature water or coolant from thecooling system 1101 can reject heat from the device 1102 using any knownmethod, including those described above and shown herein. In an example,the reduced-temperature water or coolant can directly cool the device1102. The reduced-temperature water or coolant from the cooling system1101 can circulate through channels formed in the device 1102, assimilarly described in reference to the cold plates 912 of the coolingsystem 900 of FIG. 9 . In an example, the reduced-temperature water orcoolant can be circulated through a liquid to liquid heat exchanger(LLHX) inside the device 1102 and the water or coolant can pick up heatfrom a second fluid circulating through the LLHX to reduce a temperatureof the second fluid. The device 1102 can include, but is not limited to,industrial equipment, commercial equipment, a chiller, a condenser coil,or any equipment (or in any process) using a cooling tower for heatrejection. The device 1102 can include any type of equipment orcomponent that can use water or another cooling fluid to reject heatfrom the equipment/component or from a liquid in, or associated with,the equipment/component.

It is recognized that the cooling system 1101 can be used to providecooling to more than one device, depending on a cooling load of each ofthe devices and a cooling capacity of the system 1101. In an example,the device 1102 of FIG. 11 can include a plurality of pieces ofindustrial equipment; each piece of equipment can receivereduced-temperature water or coolant which can come from a centralcooling system 1101 or from a separate cooling system 1101 dedicated toeach piece of equipment.

The present application includes methods of operating a conditioningsystem, having at least one cooling system, to control conditions in anenclosed space, such as, for example, a data center. The methods caninclude directing scavenger air through a liquid to air membrane energyexchanger (LAMEE) arranged inside a scavenger air plenum disposedoutside of the enclosed space. The scavenger air can enter the plenum atan air inlet and exit the plenum at an air outlet. The scavenger airplenum and the LAMEE can form a cooling system disposed outside of theenclosed space. The methods can include also directing water through theLAMEE such that the LAMEE has a water flow path separate from an airflow path, and evaporatively cooling takes place reducing a temperatureof the scavenger air and the water to the outdoor air wet bulbtemperature, depending on the air conditions. The methods can includedelivering a cooling fluid in a cooling fluid circuit to the enclosedspace, wherein the cooling fluid circuit can be connected to the waterflow path of the LAMEE, and providing cooling to the enclosed space withthe cooling fluid and without moving air from the enclosed space throughthe cooling system. The cooling fluid in the cooling fluid circuit canbe the reduced-temperature water from the LAMEE or a coolant cooled withthe reduced-temperature water. Cooling the enclosed space can includeair cooling of the air in the enclosed space or direct contact of thecooling fluid with one or more electrical components in the enclosedspace.

The present application includes methods of operating a conditioningsystem, having at least one cooling system, to provide cooling to one ormore devices that are not contained in an enclosed space, but rather theone or more devices can be open to the atmosphere. The methods caninclude producing reduced-temperature water with a LAMEE, as describedabove, and delivering reduced-temperature water or coolant to the one ormore devices to be cooled. The method can include cooling the one ormore devices directly with the reduced-temperature water or coolant, orcirculating the reduced-temperature water or coolant through a heatexchanger inside the device to cool a second fluid circulating throughthe heat exchanger.

The methods above of operating a conditioning system can include storingthe reduced-temperature water in a tank after the water exits the LAMEE.The methods can include providing additional cooling to the water in thetank prior to using the water to provide cooling to the enclosed spaceor device, using, for example, a DX coil inside the tank. The methodscan include directing the reduced-temperature water from the LAMEEthrough a liquid to liquid heat exchanger (LLHX) to decrease atemperature of a coolant in the cooling fluid circuit and delivering thereduced-temperature coolant to the enclosed space or to the device.

The methods can include operating a cooling system of the conditioningsystem in different modes depending on at least one of the outdoor airconditions and a setpoint temperature of the water or coolant to bedelivered to the enclosed space or device. The methods can includeoperating the cooling system in an economizer mode in which thescavenger air and the water can bypass the LAMEE and cooling of thewater can be performed by a dry coil arranged insider the scavenger airplenum. The methods can include operating the cooling system in anenhanced mode and directing the scavenger air through a pre-cooling unitarranged in the scavenger air plenum upstream of the LAMEE to conditionthe scavenger air prior to directing the scavenger air through theLAMEE.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) may be used in combination with each other. Otherembodiments can be used, such as by one of ordinary skill in the artupon reviewing the above description.

The above detailed description includes references to the accompanyingdrawings, which form a part of the detailed description. The drawingsshow, by way of illustration, specific embodiments in which theinvention can be practiced. These embodiments are also referred toherein as “examples.” Such examples can include elements in addition tothose shown or described. However, the present inventors alsocontemplate examples in which only those elements shown or described areprovided. Moreover, the present inventors also contemplate examplesusing any combination or permutation of those elements shown ordescribed (or one or more aspects thereof), either with respect to aparticular example (or one or more aspects thereof), or with respect toother examples (or one or more aspects thereof) shown or describedherein.

In the event of inconsistent usages between this document and anydocuments so incorporated by reference, the usage in this documentcontrols. In this document, the terms “a” or “an” are used, as is commonin patent documents, to include one or more than one, independent of anyother instances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” includes “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In this document, the terms “including” and “inwhich” are used as the plain-English equivalents of the respective terms“comprising” and “wherein.” Also, in the following claims, the terms“including” and “comprising” are open-ended, that is, a system, device,article, composition, formulation, or process that includes elements inaddition to those listed after such a term in a claim are still deemedto fall within the scope of that claim. Moreover, in the followingclaims, the terms “first,” “second,” and “third,” etc. are used merelyas labels, and are not intended to impose numerical requirements ontheir objects.

Method examples described herein can be machine or computer-implementedat least in part. Some examples can include a computer-readable mediumor machine-readable medium encoded with instructions operable toconfigure an electronic device to perform methods as described in theabove examples. An implementation of such methods can include code, suchas microcode, assembly language code, a higher-level language code, orthe like. Such code can include computer readable instructions forperforming various methods. The code may form portions of computerprogram products. Further, the code can be tangibly stored on one ormore volatile or non-volatile tangible computer-readable media, such asduring execution or at other times. Examples of these tangiblecomputer-readable media can include, but are not limited to, hard disks,removable magnetic disks, removable optical disks (e.g., compact disksand digital video disks), magnetic cassettes, memory cards or sticks,random access memories (RAMs), read only memories (ROMs), and the like.

Examples, as described herein, may include, or may operate on, logic ora number of components, modules, or mechanisms. Modules may be hardware,software, or firmware communicatively coupled to one or more processorsin order to carry out the operations described herein. Modules mayhardware modules, and as such modules may be considered tangibleentities capable of performing specified operations and may beconfigured or arranged in a certain manner. In an example, circuits maybe arranged (e.g., internally or with respect to external entities suchas other circuits) in a specified manner as a module. In an example, thewhole or part of one or more computer systems (e.g., a standalone,client or server computer system) or one or more hardware processors maybe configured by firmware or software (e.g., instructions, anapplication portion, or an application) as a module that operates toperform specified operations. In an example, the software may reside ona machine-readable medium. In an example, the software, when executed bythe underlying hardware of the module, causes the hardware to performthe specified operations. Accordingly, the term hardware module isunderstood to encompass a tangible entity, be that an entity that isphysically constructed, specifically configured (e.g., hardwired), ortemporarily (e.g., transitorily) configured (e.g., programmed) tooperate in a specified manner or to perform part or all of any operationdescribed herein. Considering examples in which modules are temporarilyconfigured, each of the modules need not be instantiated at any onemoment in time. For example, where the modules comprise ageneral-purpose hardware processor configured using software; thegeneral-purpose hardware processor may be configured as respectivedifferent modules at different times. Software may accordingly configurea hardware processor, for example, to constitute a particular module atone instance of time and to constitute a different module at a differentinstance of time. Modules may also be software or firmware modules,which operate to perform the methodologies described herein.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) may be used in combination with each other. Otherembodiments can be used, such as by one of ordinary skill in the artupon reviewing the above description. Also, in the above DetailedDescription, various features may be grouped together to streamline thedisclosure. This should not be interpreted as intending that anunclaimed disclosed feature is essential to any claim. Rather, inventivesubject matter may lie in less than all features of a particulardisclosed embodiment. Thus, the following claims are hereby incorporatedinto the Detailed Description, with each claim standing on its own as aseparate embodiment, and it is contemplated that such embodiments can becombined with each other in various combinations or permutations. Thescope of the invention should be determined with reference to theappended claims, along with the full scope of equivalents to which suchclaims are entitled.

The present application provides for the following exemplary embodimentsor examples, the numbering of which is not to be construed asdesignating levels of importance:

Example 1 provides a conditioning system for controlling conditions inan enclosed space and can comprise a cooling system and a cooling fluidcircuit. The cooling system can be disposed outside of the enclosedspace and include a scavenger air plenum and a liquid to air membraneenergy exchanger (LAMEE) arranged inside the plenum. The plenum can beconfigured to direct scavenger air in an air flow path from an air inletto an air outlet of the plenum. The LAMEE can comprise a cooling fluidflow path separate from the air flow path by a membrane. The LAMEE canuse the scavenger air to evaporatively cool a cooling fluid in thecooling fluid flow path such that a temperature of the cooling fluid ata fluid outlet of the LAMEE is lower than a temperature of the coolingfluid at a fluid inlet of the LAMEE. The cooling fluid circuit can beconnected to the cooling fluid flow path of the LAMEE and extend fromthe plenum into the enclosed space. The cooling fluid circuit can beconfigured to provide cooling to the enclosed space without moving airfrom the enclosed space through the cooling system.

Example 2 provides the system of Example 1 optionally further comprisinga cooling unit arranged inside the plenum upstream of the LAMEE, thecooling unit configured to condition the scavenger air prior to thescavenger air entering the LAMEE.

Example 3 provides the system of Example 2 optionally configured suchthat the cooling unit is configured to receive reduced-temperature waterfrom the LAMEE to condition the scavenger air.

Example 4 provides the system of any of Examples 1-3 optionallyconfigured such that the cooling fluid circuit is configured totransport the cooling fluid from the LAMEE to the enclosed space toprovide cooling to the enclosed space.

Example 5 provides the system of any of Examples 1-4 optionallyconfigured such that the cooling fluid in the cooling fluid flow path ofthe LAMEE is water.

Example 6 provides the system of any of Examples 1-5 optionallyconfigured such that the cooling fluid circuit includes a first coolingfluid and a second cooling fluid, and wherein the first cooling fluid isthe cooling fluid from the LAMEE.

Example 7 provides the system of Example 6 optionally configured suchthat the cooling fluid circuit includes a liquid to liquid heatexchanger configured to receive the first and second cooling fluids toreduce a temperature of the second cooling fluid.

Example 8 provides the system of any of Examples 6 or 7 optionallyconfigured such that the second cooling fluid is delivered to theenclosed space and provides cooling to the enclosed space.

Example 9 provides the system of any of Examples 1-8 optionally furthercomprising a storage tank to store the cooling fluid from the LAMEE.

Example 10 provides the system of Example 9 optionally furthercomprising a mechanical cooling system to cool the cooling fluid in thestorage tank.

Example 11 provides the system of any of Examples 1-10 optionallyfurther comprising a cooling coil arranged inside the plenum downstreamof the LAMEE and configured to use the scavenger air to cool the coolingfluid.

Example 12 provides the system of Example 11 optionally furthercomprising a bypass valve configured to control a flow of the coolingfluid, exiting the cooling coil, to at least one of the LAMEE and a tankconfigured to store the cooling fluid.

Example 13 provides the system of Example 12 optionally furthercomprising a first operating mode in which at least a portion of thecooling fluid exiting the cooling coil is recirculated back to the LAMEEand a second operating mode in which essentially all of the coolingfluid exiting the cooling coil is recirculated back to the storage tank.

Example 14 provides a conditioning system for controlling conditions inan enclosed space and can comprise a first cooling system disposedoutside of the enclosed space, a second cooling system disposed insideof the enclosed space, and a cooling fluid circuit. The first coolingsystem can comprise a scavenger air plenum having an air inlet andoutlet, the plenum configured to direct scavenger air in an air flowpath from the air inlet to the air outlet, and a liquid to air membraneenergy exchanger (LAMEE) arranged inside the plenum. The LAMEE cancomprise a water flow path separated from the air flow path by amembrane, the LAMEE configured to use the scavenger air to reduce atemperature of water in the water flow path. The cooling fluid circuitcan be connected to the water flow path of the LAMEE and to the secondcooling system. The cooling fluid circuit can provide cooling to theenclosed space without moving air from the enclosed space through thefirst cooling system.

Example 15 provides the system of Example 14 optionally configured suchthat the cooling fluid circuit includes a liquid to liquid heatexchanger (LLHX). The water from the LAMEE can pass through the LLHX toreduce a temperature of a second cooling fluid used in the secondcooling system.

Example 16 provides the system of Example 15 optionally configured suchthat the second cooling system includes direct cooling from the secondcooling fluid to one or more components in the enclosed space.

Example 17 provides the system of any of Examples 15 or 16 optionallyconfigured such that the second cooling system includes cooling of airin the enclosed space using the second cooling fluid.

Example 18 provides the system of Example 14 optionally configured suchthat the second cooling system uses reduced-temperature water from theLAMEE and the reduced-temperature water is delivered to the enclosedspace.

Example 19 provides the system of Example 18 optionally configured suchthat the reduced-temperature water directly cools one or more componentsin the enclosed space.

Example 20 provides the system of any of Examples 18 or 19 optionallyconfigured such that the second cooling system includes a cooling coilconfigured to receive the reduced-temperature water and cool air in theenclosed space that passes over the cooling coil.

Example 21 provides the system of any of Examples 14-20 optionallyconfigured such that the second cooling system includes at least one ofa cooling coil, a rear door heat exchanger, a cooling distribution unit(CDU), a cold plate, and a liquid cooling bath.

Example 22 provides a conditioning system for controlling conditions inan enclosed space and can comprise a cooling system disposed outside ofthe enclosed space and a cooling fluid circuit. The cooling system cancomprise a scavenger air plenum having an air inlet and outlet, andconfigured to direct scavenger air in an air flow path from the airinlet to the air outlet. The cooling system can comprise a liquid to airmembrane energy exchanger (LAMEE) arranged inside the plenum in the airflow path. The LAMEE can comprise a cooling fluid flow path separatedfrom the air flow path by a membrane. The LAMEE can be configured to usethe scavenger air to evaporatively cool a cooling fluid in the coolingfluid flow path such that a temperature of the cooling fluid at a fluidoutlet of the LAMEE is lower than a temperature of the cooling fluid ata fluid inlet of the LAMEE. The cooling system can comprise a firstcooling unit arranged inside the plenum between the air inlet and theLAMEE and a second cooling unit arranged inside the plenum between theLAMEE and the air outlet. The first cooling unit can be configured tocondition the scavenger air prior to the scavenger air entering theLAMEE and the second cooling unit can be configured to reduce atemperature of the cooling fluid before the cooling fluid enters theLAMEE at the fluid inlet. The cooling system can comprise one or morebypass dampers configured to permit scavenger air to enter or exit theair flow path at one or more locations between the air inlet and outlet.The cooling fluid circuit of the conditioning system can be connected tothe cooling fluid flow path of the LAMEE and extend from the plenum intothe enclosed space. The cooling fluid circuit can provide cooling to theenclosed space without moving air from the enclosed space through thecooling system.

Example 23 provides the system of Example 22 optionally configured suchthat the cooling fluid circuit includes a tank for storing the coolingfluid from the LAMEE and a pump to deliver the cooling fluid to theenclosed space.

Example 24 provides the system of Example 23 optionally furthercomprising a supplemental cooling system configured to provideadditional cooling to the cooling fluid in the tank.

Example 25 provides the system of Example 24 optionally configured suchthat the supplemental cooling system is a DX coil located inside thetank.

Example 26 provides the system of any of Examples 22-25 optionallyconfigured such that the cooling system includes a bypass valve tocontrol a flow of the cooling fluid to the LAMEE.

Example 27 provides the system of any of Examples 22-26 optionallyconfigured such that the cooling fluid in the LAMEE is water.

Example 28 provides the system of any of Examples 22-27 optionallyconfigured such that the water is delivered to the enclosed space todirectly cool one or more components in the enclosed space or cool airin the enclosed space.

Example 29 provides the system of any of Examples 22-27 optionallyconfigured such that the cooling fluid circuit includes the coolingfluid from the LAMEE, a second cooling fluid, and a liquid to liquidheat exchanger (LLHX). The cooling fluid from the LAMEE and the secondcooling fluid can pass through the LLHX to reduce a temperature of thesecond cooling fluid.

Example 30 provides the system of Example 29 optionally configured suchthat the second cooling fluid is delivered to the enclosed space todirectly cool one or more components in the enclosed space or cool airin the enclosed space.

Example 31 provides the system of any of Examples 22-30 optionallyconfigured such that the one or more bypass dampers include a first setof bypass dampers configured to direct scavenger air into the air flowpath at a location between the first cooling unit and the LAMEE.

Example 32 provides the system of any of Examples 22-31 optionallyconfigured such that the one or more bypass dampers include a second setof bypass dampers configured to direct scavenger air into the air flowpath at a location between the LAMEE and the second cooling unit.

Example 33 provides the system of any of Examples 22-32 optionallyconfigured such that the enclosed space is a data center.

Example 34 provides a method of controlling conditions in an enclosedspace. The method can include directing scavenger air through a liquidto air membrane energy exchanger (LAMEE) arranged inside a scavenger airplenum disposed outside of the enclosed space and directing waterthrough the LAMEE. The scavenger air can enter the plenum at an airinlet and exit the plenum at an air outlet. The scavenger air plenum andthe LAMEE can form a cooling system disposed outside of the enclosedspace. The LAMEE can comprise a water flow path separate from an airflow path. The LAMEE can be configured to evaporatively cool the waterusing the scavenger air and reduce a temperature of the water. Themethod can include delivering a cooling fluid in a cooling fluid circuitto the enclosed space and providing cooling to the enclosed space withthe cooling fluid and without moving air from the enclosed space throughthe cooling system. The cooling fluid circuit can be connected to thewater flow path of the LAMEE.

Example 35 provides the method of Example 34 optionally furthercomprising directing the water through a cooling unit arranged insidethe scavenger air plenum downstream or upstream of the LAMEE prior torecirculating the water back to the LAMEE.

Example 36 provides the method of any of Examples 34 or 35 optionallyconfigured such that delivering the cooling fluid to the enclosed spacecomprises delivering the reduced-temperature water from the LAMEE to theenclosed space.

Example 37 provides the method of Example 36 optionally furthercomprising delivering the reduced-temperature water from the LAMEE to astorage tank prior to delivering the reduced-temperature water to theenclosed space.

Example 38 provides the method of any of Examples 34 or 35 optionallyfurther comprising directing the reduced-temperature water from theLAMEE through a liquid to liquid heat exchanger (LLHX) to decrease atemperature of the cooling fluid in the cooling fluid circuit, prior todelivering the cooling fluid to the enclosed space.

Example 39 provides the method of any of Examples 34-38 optionallyfurther comprising delivering the reduced-temperature water from theLAMEE to a storage tank, directing scavenger air through a cooling coillocated downstream of the LAMEE, and directing water through the coolingcoil after the cooling fluid has been delivered to the enclosed spaceand before the water is recirculated back through the LAMEE or back tothe storage tank.

Example 40 provides the method of any of Examples 34-39 optionallyconfigured such that providing cooling to the enclosed space with thecooling fluid includes at least one of directly cooling one or morecomponents in the enclosed space with the cooling fluid or cooling airin the enclosed space with the cooling fluid.

Example 41 provides the method of any of Examples 34-40 optionallyfurther comprising directing the reduced-temperature water from theLAMEE through a cooling coil arranged inside the plenum upstream of theLAMEE and directing the scavenger air through the cooling coil tocondition the scavenger air before the scavenger air is directed throughthe LAMEE.

Example 42 provides a method of controlling conditions in an enclosedspace and can include directing scavenger air through a pre-cooling unitarranged in a scavenger air plenum disposed outside of the enclosedspace. The scavenger air can enter the plenum at an air inlet and exitthe plenum at an air outlet. The pre-cooling unit can be configured tocondition the scavenger air entering the plenum. The method can includedirecting water and the scavenger air exiting the pre-cooler through aliquid to air membrane energy exchanger (LAMEE) arranged inside thescavenger air plenum. The LAMEE can comprise a scavenger air flow pathseparate from a water flow path by a membrane. The LAMEE canevaporatively cool the water in the water flow path such that atemperature of the water at a water outlet of the LAMEE is lower than atemperature of the water at a water inlet. The method can includestoring the cooled water exiting the LAMEE in a tank and delivering acooling fluid in a cooling fluid circuit to the enclosed space. Thecooling fluid circuit can be connected to the water flow path of theLAMEE and the cooling fluid can be the cooled water from the tank or acoolant that is cooled by the cooled water in a liquid to liquid heatexchanger (LLHX). The method can include cooling the enclosed space withthe cooling fluid by performing at least one of air cooling of the airin the enclosed space and directly contacting the cooling fluid with oneor more components in the enclosed space. The method can includedirecting increased-temperature water from the enclosed space or fromthe LLHX through a dry coil arranged inside the scavenger air plenumdownstream of the LAMEE, the reduced-temperature scavenger air coolingthe water. The method can include recirculating the water exiting thedry coil back through the LAMEE in a first operating mode and bypassingthe LAMEE and the pre-cooling unit in a second operating mode. The LAMEEcan be bypassed by directing the water exiting the dry coil back to thetank, and directing the scavenger air into the plenum at a locationdownstream of the LAMEE and upstream of the dry coil.

Example 43 provides the method of Example 42 optionally furthercomprising bypassing the pre-cooling unit in a third operating mode,when the outdoor air conditions are mild.

Example 44 provides the method of Example 43 optionally configured suchthat bypassing the pre-cooling unit in a third operating mode includesdirecting the scavenger air into the plenum at a location downstream ofthe pre-cooling unit and upstream of the LAMEE.

Example 45 provides the method of any of Examples 43 or 44 optionallyconfigured such that bypassing the pre-cooling unit in a third operatingmode includes one of directing all of the water exiting the tank to theenclosed space or directing all of the water to the LLHX.

Example 46 provides the method of any of Examples 42-45 optionallyconfigured such that the pre-cooling unit uses cooled water from thetank to condition the scavenger air passing through the pre-coolingunit.

Example 47 provides a conditioning system for providing cooling to adevice and can include a cooling system located separate from and remoteto the device and a cooling fluid circuit. The cooling system caninclude a scavenger air plenum having an air inlet and outlet, theplenum configured to direct scavenger air in an air flow path from theair inlet to the air outlet, and a liquid to air membrane energyexchanger (LAMEE) arranged inside the plenum. The LAMEE can comprise acooling fluid flow path separated from the air flow path by a membrane.The LAMEE can be configured to use the scavenger air to evaporativelycool a cooling fluid in the cooling fluid flow path such that atemperature of the cooling fluid at a fluid outlet of the LAMEE is lowerthan a temperature of the cooling fluid at a fluid inlet of the LAMEE.The cooling fluid circuit can be connected to the cooling fluid flowpath of the LAMEE and extend from the plenum to the device. The coolingfluid circuit can be configured to provide cooling to the device.

Example 48 provides the system of Example 47 optionally configured suchthat the cooling fluid circuit is configured to transport the coolingfluid from the LAMEE to the device to provide cooling to the device.

Example 49 provides the system of Example 47 optionally configured suchthat the cooling fluid circuit includes a first cooling fluid and asecond cooling fluid, and the first cooling fluid is the cooling fluidfrom the LAMEE.

Example 50 provides the system of Example 49 optionally configured suchthat the cooling fluid circuit includes a liquid to liquid heatexchanger configured to receive the first and second cooling fluids toreduce a temperature of the second cooling fluid, and wherein the secondcooling fluid is transported to the device to provide cooling.

Example 51 provides the system of any one of Examples 47-50 optionallyconfigured such that the device is contained within an enclosed space.

Example 52 provides the system of any one of Examples 47-50 optionallyconfigured such that the device is open to the atmosphere and anexterior of the device is exposed to outdoor air.

Example 53 provides a method of providing cooling to a device and caninclude directing scavenger air through a liquid to air membrane energyexchanger (LAMEE) arranged inside a scavenger air plenum. The scavengerair can enter the plenum at an air inlet and exit the plenum at an airoutlet. The scavenger air plenum and the LAMEE can form a cooling systemseparate from and remote to the device. The method can include directingwater through the LAMEE, the LAMEE comprising a water flow path separatefrom an air flow path, the LAMEE configured to evaporatively cool thewater using the scavenger air and reduce a temperature of the water. Themethod can include storing the reduced temperature water exiting theLAMEE in a tank. The method can include delivering a cooling fluid in acooling fluid circuit to the device, the cooling fluid circuit connectedto the water flow path of the LAMEE. The cooling fluid can be thereduced temperature water from the tank or a coolant that is cooled bythe reduced temperature water in a liquid to liquid heat exchanger(LLHX). The method can include cooling the device with the cooling fluidand recirculating the cooling fluid back to the cooling system or to theLLHX.

Example 54 provides the method of Example 53 optionally configured suchthat cooling the device with the cooling fluid includes directing thecooling fluid through channels formed in an interior of the device toreject heat from the device.

Example 55 provides a system or method of any one or any combination ofExamples 1-54, which can be optionally configured such that all steps orelements recited are available to use or select from.

Various aspects of the disclosure have been described. These and otheraspects are within the scope of the following claims.

What is claimed is:
 1. A method of controlling conditions in an enclosedspace comprises: directing scavenger air through a liquid to airmembrane energy exchanger (LAMEE) arranged inside a scavenger air plenumdisposed outside of the enclosed space, the scavenger air entering theplenum at an air inlet and exiting the plenum at an air outlet, thescavenger air plenum and the LAMEE forming a cooling system disposedoutside of the enclosed space; directing water through the LAMEE, theLAMEE comprising a water flow path separate from an air flow path, theLAMEE configured to evaporatively cool the water using the scavenger airand reduce a temperature of the water; and delivering a cooling fluid ina cooling fluid circuit to the enclosed space, the cooling fluid circuitconnected to the water flow path of the LAMEE; and providing cooling tothe enclosed space with the cooling fluid and without moving air fromthe enclosed space through the cooling system.
 2. The method of claim 1further comprising: directing the water through a cooling unit arrangedinside the scavenger air plenum downstream or upstream of the LAMEEprior to recirculating the water back to the LAMEE.
 3. The method ofclaim 1 wherein delivering the cooling fluid to the enclosed spacecomprises delivering the reduced-temperature water from the LAMEE to theenclosed space.
 4. The method of claim 3 further comprising: deliveringthe reduced-temperature water from the LAMEE to a storage tank prior todelivering the reduced-temperature water to the enclosed space.
 5. Themethod of 4 further comprising: directing the reduced-temperature waterfrom the LAMEE through a liquid to liquid heat exchanger (LLHX) todecrease a temperature of the cooling fluid in the cooling fluidcircuit, prior to delivering the cooling fluid to the enclosed space. 6.The method of claim 1 further comprising: delivering thereduced-temperature water from the LAMEE to a storage tank; directingscavenger air through a cooling coil located downstream of the LAMEE;and directing water through the cooling coil after the cooling fluid hasbeen delivered to the enclosed space and before the water isrecirculated back through the LAMEE or back to the storage tank.
 7. Themethod of claim 1 wherein providing cooling to the enclosed space withthe cooling fluid includes at least one of directly cooling one or morecomponents in the enclosed space with the cooling fluid or sensiblycooling air in the enclosed space with the cooling fluid.
 8. The methodof claim 1 further comprising: directing the reduced-temperature waterfrom the LAMEE through a cooling coil arranged inside the plenumupstream of the LAMEE; and directing the scavenger air through thecooling coil to condition the scavenger air before the scavenger air isdirected through the LAMEE.
 9. A method of providing cooling to adevice, the method comprising: directing scavenger air through a liquidto air membrane energy exchanger (LAMEE) arranged inside a scavenger airplenum, the scavenger air entering the plenum at an air inlet andexiting the plenum at an air outlet, the scavenger air plenum and theLAMEE forming a cooling system separate from and remote to the device;directing water through the LAMEE, the LAMEE comprising a water flowpath separate from an air flow path, the LAMEE configured toevaporatively cool the water using the scavenger air and reduce atemperature of the water; storing the reduced temperature water exitingthe LAMEE in a tank; delivering a cooling fluid in a cooling fluidcircuit to the device, the cooling fluid circuit connected to the waterflow path of the LAMEE, the cooling fluid is the reduced temperaturewater from the tank or a coolant that is cooled by the reducedtemperature water in a liquid to liquid heat exchanger (LLHX); coolingthe device with the cooling fluid; and recirculating the cooling fluidback to the cooling system or to the LLHX.
 10. The method of claim 9wherein cooling the device with the cooling fluid includes directing thecooling fluid through channels formed in an interior of the device toreject heat from the device.